Standard Job Description

Lockheed Martin Missiles and Fire Control (MFC) is seeking a Staff Electromechanical Design Engineer to serve as a technical authority and hardware lead within our electromechanical engineering organization, specializing in 3D Heterogeneous Integration (3DHI). MFC is a recognized designer, developer, and manufacturer of precision engagement aerospace and defense systems for the U.S. and allied militaries. This role is suited for an experienced electromechanical professional who can drive technical strategy, lead IPT efforts, mentor engineers, and ensure mission-critical hardware meets the highest standards of reliability and performance.

What You Will Be Doing

Microelectronics hardware development engineer with ownership of package hardware design, heat transfer and thermal dissipation, structural integrity and mechanical survivability of completed 3DHI packages throughout their operational lifespans.

• Design multichip package devices, including package substrates, Integrated Heat Spreaders and attach mechanism, stiffeners, and complex thermal management system integration to manage high thermal dissipation requirements.
• Collaborate with mechanical and electrical engineering analysts to develop advanced Finite Element Analysis (FEA) to perform Multiphysics models and simulations for thermal cycling and reliability, power integrity and electrical performance, and  mechanical stress including operation shock and vibration.
• Define and execute packaging qualification plans adhering to project requirements, JEDEC and MIL-SPEC standardizations (e.g., Highly Accelerated Stress Testing / HAST).
• Investigate and perform failure analysis loops on critical component interface and intermetallic connections including anomalies like cracked solder joints, delaminated layers, and warped package substrates.  Implement corrective actions to mitigate identified failure modes in manufacturing and incorporate findings into product revisions while capturing lessons learned for future development activity.
• Architecting, designing, and validating advanced circuit card packages
• Designing high-density circuit cards, cable assemblies, and interconnect solutions that meet size, weight, power, security, and performance constraints
• Designing and developing electromechanical systems for advanced programs, special programs, and IRAD programs, including printed wiring boards, circuit/electronic card assemblies, harness assemblies, and sub-assemblies
• Leading and documenting design assurance reviews, tracking issues, and driving corrective actions to closure
• Performing thermal, signal integrity, and electromagnetic compatibility analyses to ensure robust operation in harsh DoD environments
• Coordinating with cross-functional teams — systems, hardware, software, test, and supply chain — to deliver high-quality results on schedule and within budget
• Managing risk, schedule, and earned value metrics, and reporting status to senior leadership
• Setting clear technical direction for program engineers based on customer requests and program goals
• Mentoring and developing engineers, fostering an inclusive environment and driving continuous improvement initiatives
• Communicating technical status, risks, and recommendations clearly to internal stakeholders and external customers

This position offers the opportunity to shape the future of electromechanical engineering capabilities at Lockheed Martin and to have a significant impact across the MFC enterprise.

Candidates may be subject to a government security investigation and must meet eligibility requirements for access to classified information. Some travel may be required

Basic Qualifications

• Bachelor of Science degree in Electrical Engineering, Mechanical Engineering, or a closely related STEM field from an accredited university; Master’s degree or PhD preferred or Minimum 15 years of professional experience in Electromechanical Engineering or related discipline without a degree
• 3D Heterogeneous Integration (3DHI)
• Advanced Packaging
• Technical or project leadership experience supporting the production of high-reliability electronics products
• Microelectronics design
• Proficient in CREO modeling and electromechanical system design
• Project leadership/management experience throughout the engineering/production lifecycle: scoping, sizing, cost estimation, planning, scheduling, staffing, tracking, and earned value management (EVM)
• Experience in presentation, oral and written communication to facilitate effective and efficient interchanges between co-workers, leaders, and customers
• Experience working with cross-functional teams across multiple locations
• Experience capturing flowed and derived requirements for electromechanical designs
• Must be a US Citizen; must possess or be able to obtain a DoD Secret security clearance

Desired Skills

• Thermal Interface Materials (TIM1/TIM2), Lid Attach, Package Stiffener Rings, JEDEC Qualification, HAST, Thermo-mechanical Stress
• Multiphysics modeling
• Direct experience supporting production (manufacturing and test)
• Demonstrated leadership skills and behaviors that align with Full Spectrum Leadership Imperatives
• Preparation for and participation in major program design reviews (PDR, CDR)
• Experience troubleshooting and resolving technical issues
• Proven understanding of electronics standards and processes
• Proven understanding of mechanical standards and processes
• Proven understanding of electronic packaging principles
• Demonstrated ability to multitask and adapt to changing priorities
• Experience with military defense hardware
• Experience with parts and materials selections
• Ability to perform design trade studies evaluating cost, weight, packaging, and power benefits
• Flex circuit and microelectronics design experience
• Active DoD Secret or Top Secret Clearance