Standard Job Description

You will be the Semiconductor Process Engineering Mgr for the Advanced Focal Plane Array Production Team. Our team is responsible for supporting production operations, developing and optimizing semiconductor processes, managing equipment procurement, and driving yield and efficiency for Advanced Focal Plane arrays.

What You Will be Doing

As the Semiconductor Process Engineering Mgr you will be responsible for leading a high‑mix production team that fabricates cutting‑edge infrared sensor arrays. Your responsibilities will include, but are not limited to:

• Directing wicking, plasma cleaning, wirebonding, substrate thinning, dicing, AR coating, and flip‑chip bonding processes.
• Developing and optimizing process flows, tooling, and equipment to maximize yield, efficiency, and throughput.
• Collaborating with development and integration engineers to introduce new capabilities and lead capital procurement projects.
• Analyzing test data, identifying trends, and implementing corrective actions for process control.
• Creating and maintaining documentation, work instructions, and process control checklists.

Why Join Us
The ideal candidate is a collaborative technical leader who thrives in a fast‑paced environment and is passionate about advancing FPA technology. This role offers the chance to shape critical manufacturing processes, mentor a skilled team, and make a tangible impact on next‑generation infrared sensors.

We are committed to supporting your work‑life balance and overall well‑being, offering flexible scheduling options. Learn more about Lockheed Martin’s comprehensive benefits package here

Further Information About This Opportunity
This position is located in Goleta, CA. Discover more about Lockheed Martin Missiles and Fire Control Santa Barbara Focal Plane here.

MUST BE A U.S. CITIZEN - This position is located at a facility that requires special access. The selected candidate must be able to obtain a Secret clearance.

Basic Qualifications

• Bachelors degree from and accredited college in Engineering, Physics, or related experience
• Minimum of 8 years of experience in semiconductor packaging or FPA manufacturing in a clean room environment with technical understanding of epoxy die attach/bonding, polishing, or Anti-Reflection Coating
• Minimum of 5 years of technical team leadership experience.
• Must be a US Citizen as this position is located in a facility that requires special access.

Desired Skills

• Advanced degree in Materials Engineering, Chemical Engineering, Mechanical Engineering or Physics with more than 10 years of industry experience
• Background in IR FPA packaging, specifically flip-chip hybridization techniques. 
• Knowledge of semiconductor device physics, photodetectors, and FPAs.
• Proficiency in MS Office (Word, PowerPoint, Excel).
• Excellent engineering documentation skills and communication skills.
• Ability to interface effectively from the technician level to senior management with excellent communication (written and verbal) and interpersonal skills, with the ability to collaborate effectively with cross-functional teams and train technical staff.
• Experience leading multifunctional teams.
• Ability to multi-task, organize and prioritize assignments independently.
• Experience in Design of Experiments (DOE), statistical process control (SPC), and data analysis software packages (e.g., JMP).
• Experience with Lean/Six Sigma methodologies and data analysis software such as MATLAB or JMP.
• Background in IR FPA packaging, specifically flip-chip hybridization techniques.
• Knowledge of semiconductor device physics, photodetectors, and FPAs.
• Proficiency in MS Office (Word, PowerPoint, Excel).
• Excellent engineering documentation skills and communication skills
• Experience in developing skill sets of subordinates, situational leadership, and high emotional IQ.