Standard Job Description

The Electronics Engineer Sr Stf  is responsible for collaborating with the RF SME to provide technical leadership or individually contribute on the design & capture the IAD Digital end‑to‑end design elements. Support technical management, design development, integration & verification of high‑performance radar and communications systems front‑ends and digital signal‑processing pipelines for aerospace and defense programs. The role combines expertise in microwave/RF hardware, high‑speed digital board design & FPGA/ASIC‑based radar signal processing. The incumbent will lead technical efforts, mentor junior engineers & ensure that all solutions meet stringent aerospace, radiation‑hardening & security standards for operation in hostile environments (temperature extremes, vibration, vacuum, and radiation). Researches, develops, designs, and tests electrical components, equipment, systems, and networks. Designs electrical equipment, facilities, components, products, and systems for commercial, industrial, and domestic purposes. Researches, designs, develops, and tests a variety of electronic equipment & systems, including radar & radiation detection equipment; radio, television & other communications equipment & systems; circuitry components; analog & digital computers; and control & test equipment. Researches, designs, develops, & tests a variety of electronic equipment & systems, including radar & radiation detection equipment; radio, television & other communications equipment & systems; circuitry components; analog & digital computers; and control & test equipment.

Key Responsibilities

• Lead and execute RF front‑end design (antennas, feed networks, LNAs, mixers, synthesizers, PAs) for X‑, Ku‑, Ka‑band radar systems using CAD tools (Altium, Xpedition, MATLAB), ensuring end‑to‑end IAD digital capture and seamless integration from concept through production readiness.
• Design high‑speed digital board‑level architectures (high‑density interconnects (HDI), multi‑layer Printed Circuit Boards (PCBs), high‑speed serial links, RF‑data converter interfaces) including signal‑integrity, power‑integrity, and EMI/EMC mitigation to guarantee reliable operation across temperature extremes, vibration, vacuum, and radiation environments.
• Plan and execute hardware‑in‑the‑loop (HIL) and model‑based simulations (MATLAB/Simulink, LabVIEW) to validate RF‑digital co‑design, system performance, and qualification against hostile‑environment stressors and classified security requirements.
• Lead technical reviews (PDR, CDR, FAI) and present design status, risk assessments, and mitigation plans to cross‑functional teams and program leadership; support proposal development, budget justification, and lifecycle documentation management.
• Ensure full compliance with aerospace standards (DO‑178C, DO‑254, MIL‑STD‑461, MIL‑STD‑810) and classified data handling protocols; manage design artifacts in authorized repositories with rigorous radiation‑hardening and security controls.
• Mentor and develop mid‑level and junior RF, digital, and firmware engineers; conduct design‑review training and foster a culture of technical excellence, radiation‑aware design practices, and secure hardware development.
• Monitor emerging radar technologies (software‑defined radar, digital beam‑forming ASICs, AI‑enabled signal processing) and recommend strategic adoption aligned with program objectives, radiation qualification pathways, and LM security mandates.
• Coordinate and support test and verification activities using VNAs, spectrum analyzers, phase‑noise testers, OTA ranges, and high‑speed oscilloscopes; analyze results, drive design iterations, and confirm that all performance and qualification targets are met for hostile‑environment operation.

Basic Qualifications

• Education: Bachelor’s degree in Electrical Engineering, Microwave Engineering, Computer Engineering, or a closely related field.
• Experience: ≥ 10 years of hands‑on electrical design experience, and some familiarity with high‑speed FPGA/ASIC development for communications or radar applications.
• Deep expertise in high‑speed PCB design (signal/power integrity, HDI stack-ups, >10 Gb/s serial links) and EMI/EMC mitigation for operation across temperature extremes, vibration, vacuum, and radiation environments.
• Strong working knowledge of aerospace development standards (DO‑178C, DO‑254, MIL‑STD‑461, MIL‑STD‑810) and radiation‑hardening design practices.
• Substantial hands‑on test and debugging experience in laboratory and/or anechoic‑chamber environments for RF/microwave and high‑speed digital hardware. Proven use of VNAs, spectrum analyzers, oscilloscopes, signal generators, and environmental test chambers (temperature extremes, vibration, vacuum, radiation emulation) to validate design performance, troubleshoot issues, and ensure compliance with aerospace standards (MIL‑STD‑461, MIL‑STD‑810). Experience supporting hardware‑in‑the‑loop validation and qualification for hostile‑environment operation.
• Implement and optimize radar signal‑processing algorithms (pulse‑compression, FMCW range‑FFT, MTI/CFAR, Doppler filtering, digital beam‑forming, MIMO waveforms) on Xilinx UltraScale+/Versal, RFSoC, and ASIC platforms using RTL (Verilog/SystemVerilog, VHDL) and HLS, with emphasis on radiation‑hardened, power‑efficient architectures for aerospace deployment.
• Technical Skills:   Proficient in eCAD design tools (Altium, Xpedition, Pspice, LTspice).   RTL coding (Verilog, SystemVerilog, VHDL) and familiarity with HLS (Vitis, Vivado HLS).   Expertise in high‑speed PCB design (Altium, Xpedition) and signal integrity analysis.   Experience with radar signal‑processing algorithms and implementation on Xilinx RFSoC/UltraScale+ or comparable platforms.
• Clearance: Ability to obtain & maintain a security clearance.

Desired Skills

• Software & Modeling: MATLAB/Simulink, Python, LabVIEW, and familiarity with model‑based design workflows.
• Proven implementation and optimization of radar signal‑processing algorithms (pulse‑compression, FMCW range‑FFT, MTI/CFAR, Doppler filtering, digital beam‑forming, MIMO waveforms) on RFSoC/UltraScale+ hardware.
• Soft Skills: Excellent written and verbal communication, strong problem‑solving ability, and proven capability to work cross‑functionally with RF, mechanical, firmware, and test teams.
• Clearance: Active Top‑Secret Sensitive Compartmented Information (TS/SCI) clearance, or the ability to obtain a Top‑Secret clearance.