Standard Job Description

The Senior Thermal Analyst team member will be responsible for performing preliminary and detailed level thermal design and analysis on spacecraft components (RF and Power Electronics) and subsystems. This analysis will include the modelling of the radiative heat transfer on-orbit space environment (using tools such as Thermal Desktop) as well as box and board level analysis (using tools such as Ansys Electronics Desktop).

Other related responsibilities include providing technical reports and input to data packages for peer and customer reviews, presentation of resultant design and analysis data to payload/spacecraft design/engineering team, customer technical representatives, and Program Office personnel at technical exchange meetings and formal design reviews, and the review, interpretation, flow down and implementation of program requirements. The team member will provide thermal engineering planning and support for TVAC testing at LM Space facilities. They will support post processing and analyzing of TVAC and On-Orbit flight data. 

The team member will work interactively with diverse engineering disciplines in a fast-paced environment to develop cost-effective solutions to thermal control requirements which also satisfy producibility objectives defined by Manufacturing and Quality.  The engineer must develop technical solutions to complex problems which require the regular use of ingenuity and creativity, with work being performed without appreciable direction.  The employee must exercise considerable latitude in determining technical objectives and approaches to assignments where completed work is reviewed from a relatively long-term perspective, for desired results.

Standard Job Description: Applies electrical, electronic and mechanical principles to components and systems, including assembly, analysis, and documentation of results; construction of developmental assemblies, sub-assemblies and components; and quality testing. Supports and participates in the design, test, modification, fabrication and assembly of prototype electromechanical systems.  Proficient in AI prompting as it applies to this position and practice. 

Basic Qualifications

• Knowledge of heat transfer and thermodynamics related to space applications.
• Proficiency with Thermal Desktop, Ansys Electronics Desktop (AEDT)/IcePak, or other thermal analysis software.
• 9 years of professional experience with a related Bachelor’s degree from an accredited college or equivalent experience/combined education; or 7 years of professional experience with a related Master’s degree; or 4 years of professional experience required with a related PhD.
• Excellent communication skills (technical writing and presentation) and use of relevant Microsoft Office software (Excel, Word, PowerPoint).
• Ability to obtain and maintain a DoD Security clearance.

Desired Skills

• Experience with on-orbit thermal analysis as well as strong analytical skills related to the design, analysis, and validation of payload thermal effects, including proficiency utilizing thermal analysis modeling tools such as Thermal Desktop and Ansys Electronics Desktop (AEDT)/IcePak (familiarity with NASTRAN and SINDA are also desirable).
• Creativity and innovating skills to solve issues related to anomalous performance of any aspect of the payload thermal system.
• Knowledge of electronics packaging concepts and architectures along with experience with thermal analysis of electronics assemblies from circuit card assembly up to payload level.
• Master’s degree or higher in Mechanical Engineering or a related field.
• Proven ability to perform technical tasks on schedule and within budget.
• Ability to collaborate across multidisciplinary engineering teams and effectively communicate technical issues and recommendations.
• Ability to develop, interpret, and verify thermal requirements and demonstrate component/system compliance with allowable temperature limits.
• Experience with TVAC testing, including planning, setup, execution, and post-test model correlation.
• Experience with solder joint fatigue for electronic components.
• Possess engineering and operational experience with payload or spacecraft thermal control subsystem hardware.  
• Experience with the design and implementation of advanced thermal management/control methods and techniques (passive and active) for hardware operating in ambient and vacuum environments.
• Direct experience with thermal hardware such as temperature sensors, heaters, heat pipes, etc.
• Familiarity with INST-EEE-002 Instructions for EEE Parts Selection, Screening, Qualification, and Derating, GSFC-STD-7000 General Environmental Verification Standard (GEVS), and SMC-S-016 Air Force Space Command Space and Missile Systems Center Standard.
• Ability and willingness to mentor junior engineers.
• Active DoD Security clearance, TS/SCI with CI Poly. 

If a candidate doesn't currently have all these skills, they should have the appropriate background and aptitude for developing these skills.